Wide Bandgap Power Semiconductor Packaging: Materials, Components, and Reliability - Woodhead Publishing Series in Electronic and Optical Materials - Katsuaki Suganuma - Books - Elsevier Science & Technology - 9780081020944 - May 30, 2018
In case cover and title do not match, the title is correct

Katsuaki Suganuma
Wide Bandgap Power Semiconductor Packaging: Materials, Components, and Reliability - Woodhead Publishing Series in Electronic and Optical Materials

Price
$ 255.99
excl. VAT

Ordered from remote warehouse

Expected to be ready for shipping Jun 24 - Jul 6

Our customers say:

14-day return policy in accordance with European consumer protection law
Top ranking on Trustpilot
Add to your iMusic wish list

240 pages

Media Books     Paperback Book   (Book with soft cover and glued back)
Released May 30, 2018
ISBN13 9780081020944
Publishers Elsevier Science & Technology
Pages 240
Dimensions 228 × 155 × 13 mm   ·   326 g
Editor Suganuma, Katsuaki (The Institute of Scientific and Industrial Research, Osaka University, Japan)

More by Katsuaki Suganuma

Show all

Mere med samme udgiver

See all of Katsuaki Suganuma ( e.g. Paperback Book and Hardcover Book )