Stress and Strain Engineering at Nanoscale in Semiconductor Devices - Maiti, Chinmay K. (SOA University Bhubaneswar, Odisha, India) - Books - Taylor & Francis Ltd - 9780367519292 - June 30, 2021
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Stress and Strain Engineering at Nanoscale in Semiconductor Devices 1st edition

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Based on 3D process and device simulations with mechanical stress simulations by finite element techniques, this book explains performance assessment of nanoscale devices with strained SiGe and other stressors. It explains the process-induced stress transfer and developments at 7nm technology and below node in the area of strain-engineered devices.


304 pages, 136 Line drawings, black and white; 3 Halftones, black and white; 23 Tables, black and wh

Media Books     Hardcover Book   (Book with hard spine and cover)
Released June 30, 2021
ISBN13 9780367519292
Publishers Taylor & Francis Ltd
Pages 260
Dimensions 241 × 161 × 22 mm   ·   560 g
Language English  

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