Integrated Circuit, Hybrid, and Multichip Module Package Design Guidelines: A Focus on Reliability - Pecht, Michael G. (University of Maryland, College Park, USA) - Books - John Wiley & Sons Inc - 9780471594468 - March 31, 1994
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Pecht, Michael G. (University of Maryland, College Park, USA)
Integrated Circuit, Hybrid, and Multichip Module Package Design Guidelines: A Focus on Reliability

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Circuit designers, packaging engineers, printed board fabricators, and procurement personnel will find this booka s microelectronic package design--for--reliability guidelines and approaches essential for achieving their life--cycle, cost--effectiveness, and on--time delivery goals.

464 pages, bibliography

Media Books     Hardcover Book   (Book with hard spine and cover)
Released March 31, 1994
ISBN13 9780471594468
Publishers John Wiley & Sons Inc
Pages 464
Dimensions 163 × 238 × 31 mm   ·   839 g

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