Thermal Design of Liquid Cooled Microelectronic Equipment - ASME Press Book Series on Electronic Packaging - Lian-Tuu Yeh - Books - American Society of Mechanical Engineers - 9780791861936 - July 31, 2019
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Lian-Tuu Yeh
Thermal Design of Liquid Cooled Microelectronic Equipment - ASME Press Book Series on Electronic Packaging

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Focuses on providing practical solutions to thermal issues related to high power systems where liquid cooling is required. The book serves as a general thermal design guide for any liquid cooled systems with the main focus on microelectronic equipment that includes digital and/or analogue devices.

277 pages

Media Books     Hardcover Book   (Book with hard spine and cover)
Released July 31, 2019
Original release date 2020
ISBN13 9780791861936
Publishers American Society of Mechanical Engineers
Pages 277
Dimensions 237 × 160 × 24 mm   ·   630 g

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