Tell your friends about this item:
High-Frequency Characterization of Electronic Packaging - Electronic Packaging and Interconnects Luc Martens 1998 edition
High-Frequency Characterization of Electronic Packaging - Electronic Packaging and Interconnects
Luc Martens
High-Frequency Characterization of Electronic Packaging will be of interest to researchers and designers of high-frequency electronic packaging.
170 pages, biography
| Media | Books Hardcover Book (Book with hard spine and cover) |
| Released | October 31, 1998 |
| ISBN13 | 9780792383079 |
| Publishers | Springer |
| Pages | 158 |
| Dimensions | 155 × 235 × 11 mm · 376 g |
| Language | English |