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Fatigue Life Prediction of Solder Joints in Electronic Packages with Ansys - the Springer International Series in Engineering and Computer Science Erdogan Madenci Softcover Reprint of the Original 1st Ed. 2003 edition
Fatigue Life Prediction of Solder Joints in Electronic Packages with Ansys - the Springer International Series in Engineering and Computer Science
Erdogan Madenci
185 pages, biography
| Media | Books Paperback Book (Book with soft cover and glued back) |
| Released | October 14, 2012 |
| ISBN13 | 9781461349891 |
| Publishers | Springer-Verlag New York Inc. |
| Pages | 185 |
| Dimensions | 156 × 234 × 11 mm · 299 g |
| Language | English |
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