Chemical-Mechanical Polishing of Low Dielectric Constant Polymers and Organosilicate Glasses: Fundamental Mechanisms and Application to IC Interconnect Technology - Christopher Lyle Borst - Books - Springer-Verlag New York Inc. - 9781461354246 - February 23, 2014
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Christopher Lyle Borst
Chemical-Mechanical Polishing of Low Dielectric Constant Polymers and Organosilicate Glasses: Fundamental Mechanisms and Application to IC Interconnect Technology Softcover reprint of the original 1st ed. 2002 edition

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As semiconductor manufacturers implement copper conductors in advanced interconnect schemes, research and development efforts shift toward the selection of an insulator that can take maximum advantage of the lower power and faster signal propagation allowed by copper interconnects.

243 pages, biography

Media Books     Paperback Book   (Book with soft cover and glued back)
Released February 23, 2014
ISBN13 9781461354246
Publishers Springer-Verlag New York Inc.
Pages 229
Dimensions 155 × 235 × 13 mm   ·   353 g
Language English  

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