Lawrence L. Rosine
Advances in Electronic Circuit Packaging: Volume 5 Proceedings of the Fifth International Electronic Circuit Packaging Symposium sponsored by the University of Colorado, EDN (Electrical Design News), and Design News, held at Boulder, Colorado, August 19-2 Lawrence L. Rosine Softcover reprint of the original 1st ed. 1965 edition

Name: Advances in Electronic Circuit Packaging: Volume 5 Proceedings of the Fifth International Electronic Circuit Packaging Symposium sponsored by the University of Colorado, EDN (Electrical Design News), and Design News, held at Boulder, Colorado, August 19-2
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Author: Lawrence L. Rosine

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Advances in Electronic Circuit Packaging: Volume 5 Proceedings of the Fifth International Electronic Circuit Packaging Symposium sponsored by the University of Colorado, EDN (Electrical Design News), and Design News, held at Boulder, Colorado, August 19-2

Lawrence L. Rosine

Softcover reprint of the original 1st ed. 1965 edition

303 pages, 267 black & white illustrations, biography

Media	Books Paperback Book (Book with soft cover and glued back)
Released	1965
ISBN13	9781489972958
Publishers	Springer-Verlag New York Inc.
Pages	297
Dimensions	178 × 254 × 16 mm · 530 g
Language	English