Three-Dimensional Integration and Modeling: A Revolution in RF and Wireless Packaging - Synthesis Lectures on Computational Electromagnetics - Jong-Hoon Lee - Books - Springer International Publishing AG - 9783031005756 - December 31, 2007
In case cover and title do not match, the title is correct

Jong-Hoon Lee
Three-Dimensional Integration and Modeling: A Revolution in RF and Wireless Packaging - Synthesis Lectures on Computational Electromagnetics

Price
$ 37.99
excl. VAT

Ordered from remote warehouse

Expected to be ready for shipping Jun 1 - 5

Our customers say:

14-day return policy in accordance with European consumer protection law
Top ranking on Trustpilot
Add to your iMusic wish list

Table of Contents: Introduction / Background on Technologies for Millimeter-Wave Passive Front-Ends / Three-Dimensional Packaging in Multilayer Organic Substrates / Microstrip-Type Integrated Passives / Cavity-Type Integrated Passives / Three-Dimensional Antenna Architectures / Fully Integrated Three-Dimensional Passive Front-Ends / References

108 pages, X, 108 p.

Media Books     Paperback Book   (Book with soft cover and glued back)
Released December 31, 2007
ISBN13 9783031005756
Publishers Springer International Publishing AG
Pages 108
Dimensions 190 × 235 × 12 mm   ·   240 g
Language English  

See all of Jong-Hoon Lee ( e.g. Paperback Book )