More-than-Moore 2.5D and 3D SiP Integration - Riko Radojcic - Books - Springer International Publishing AG - 9783319849324 - May 4, 2018
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Riko Radojcic
More-than-Moore 2.5D and 3D SiP Integration Softcover reprint of the original 1st ed. 2017 edition

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This book presents a realistic and a holistic review of the microelectronic and semiconductor technology options in the post Moore’s Law regime.

182 pages, 58 Tables, color; 66 Illustrations, color; 2 Illustrations, black and white; XV, 182 p. 6

Media Books     Paperback Book   (Book with soft cover and glued back)
Released May 4, 2018
ISBN13 9783319849324
Publishers Springer International Publishing AG
Pages 182
Dimensions 150 × 220 × 10 mm   ·   285 g
Language German  

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