Wafer Bonding: Applications and Technology - Springer Series in Materials Science - U. G÷sele - Books - Springer-Verlag Berlin and Heidelberg Gm - 9783540210498 - May 14, 2004
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U. G÷sele
Wafer Bonding: Applications and Technology - Springer Series in Materials Science 2004 edition

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The topics include bonding-based fabrication methods of silicon-on-insulator, photonic crystals, VCSELs, SiGe-based FETs, MEMS together with hybrid integration and laser lift-off.

504 pages, 363 black & white illustrations, 20 colour illustrations, biography

Media Books     Hardcover Book   (Book with hard spine and cover)
Released May 14, 2004
ISBN13 9783540210498
Publishers Springer-Verlag Berlin and Heidelberg Gm
Pages 504
Dimensions 155 × 235 × 33 mm   ·   839 g
Language English   German  
Editor Alexe, Marin
Editor Goesele, Ulrich

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