Integrated Modeling of Chemical Mechanical Planarization for Sub-Micron IC Fabrication: From Particle Scale to Feature, Die and Wafer Scales - Jianfeng Luo - Books - Springer-Verlag Berlin and Heidelberg Gm - 9783540223696 - October 7, 2004
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Jianfeng Luo
Integrated Modeling of Chemical Mechanical Planarization for Sub-Micron IC Fabrication: From Particle Scale to Feature, Die and Wafer Scales 2004 edition

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Chemical mechanical planarization, or chemical mechanical polishing as it is simultaneously referred to, has emerged as one of the critical processes in semiconductor manufacturing and in the production of other related products and devices, MEMS for example.

311 pages, biography

Media Books     Hardcover Book   (Book with hard spine and cover)
Released October 7, 2004
ISBN13 9783540223696
Publishers Springer-Verlag Berlin and Heidelberg Gm
Pages 311
Dimensions 155 × 235 × 20 mm   ·   653 g
Language English   German  

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