Wafer Bonding: Applications and Technology - Springer Series in Materials Science - Marin Alexe - Books - Springer-Verlag Berlin and Heidelberg Gm - 9783642059155 - September 30, 2011
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Marin Alexe
Wafer Bonding: Applications and Technology - Springer Series in Materials Science Softcover reprint of the original 1st ed. 2004 edition

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The topics include bonding-based fabrication methods of silicon-on-insulator, photonic crystals, VCSELs, SiGe-based FETs, MEMS together with hybrid integration and laser lift-off.

519 pages, 363 black & white illustrations, 20 colour illustrations, biography

Media Books     Paperback Book   (Book with soft cover and glued back)
Released September 30, 2011
ISBN13 9783642059155
Publishers Springer-Verlag Berlin and Heidelberg Gm
Pages 504
Dimensions 155 × 235 × 27 mm   ·   725 g
Language German  
Editor Alexe, Marin
Editor Goesele, Ulrich

Mere med samme udgiver

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