Chemical-Mechanical Planarization of Semiconductor Materials - Springer Series in Materials Science - M R Oliver - Books - Springer-Verlag Berlin and Heidelberg Gm - 9783642077388 - December 1, 2010
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M R Oliver
Chemical-Mechanical Planarization of Semiconductor Materials - Springer Series in Materials Science Softcover reprint of hardcover 1st ed. 2004 edition

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This book contains a comprehensive review of CMP (Chemical-Mechanical Planarization) technology, one of the most exciting areas in the field of semiconductor technology. The leading edge issues of damascene and new dielectrics as well as slurryless technology are discussed.

428 pages, biography

Media Books     Paperback Book   (Book with soft cover and glued back)
Released December 1, 2010
ISBN13 9783642077388
Publishers Springer-Verlag Berlin and Heidelberg Gm
Pages 428
Dimensions 155 × 235 × 22 mm   ·   612 g
Language German  
Editor Oliver, M.R.

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