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Research on Chemical Mechanical Polishing Mechanism of Novel Diffusion Barrier R Cheng 1st ed. 2018 edition
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Research on Chemical Mechanical Polishing Mechanism of Novel Diffusion Barrier R
Cheng
This thesis addresses selected unsolved problems in the chemical mechanical polishing process (CMP) for integrated circuits using ruthenium (Ru) as a novel barrier layer material.
137 pages, 103 Illustrations, black and white; XVIII, 137 p. 103 illus.
| Media | Books Book |
| Released | September 18, 2017 |
| ISBN13 | 9789811061646 |
| Publishers | Springer Verlag, Singapore |
| Pages | 137 |
| Dimensions | 150 × 220 × 20 mm · 399 g |
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