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Embedded Cooling Of Electronic Devices: Conduction, Evaporation, And Single- And Two-phase Convection - Wspc Series In Advanced Integration And Packaging
Embedded Cooling Of Electronic Devices: Conduction, Evaporation, And Single- And Two-phase Convection - Wspc Series In Advanced Integration And Packaging
| Media | Books Hardcover Book (Book with hard spine and cover) |
| Released | February 16, 2024 |
| ISBN13 | 9789811277931 |
| Publishers | World Scientific Publishing Co Pte Ltd |
| Pages | 480 |
| Dimensions | 150 × 220 × 20 mm · 840 g |
| Series Editor | Bar-cohen, Avram (Univ Of Maryland, Usa) |