Research on Chemical Mechanical Polishing Mechanism of Novel Diffusion Barrier Ru for Cu Interconnect - Springer Theses - Jie Cheng - Books - Springer Verlag, Singapore - 9789811355851 - January 30, 2019
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Jie Cheng
Research on Chemical Mechanical Polishing Mechanism of Novel Diffusion Barrier Ru for Cu Interconnect - Springer Theses Softcover reprint of the original 1st ed. 2018 edition

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This thesis addresses selected unsolved problems in the chemical mechanical polishing process (CMP) for integrated circuits using ruthenium (Ru) as a novel barrier layer material.

137 pages, 103 Illustrations, black and white; XVIII, 137 p. 103 illus.

Media Books     Paperback Book   (Book with soft cover and glued back)
Released January 30, 2019
ISBN13 9789811355851
Publishers Springer Verlag, Singapore
Pages 137
Dimensions 150 × 220 × 10 mm   ·   248 g

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