Electromigration In Ulsi Interconnections - International Series On Advances In Solid State Electronics And Technology - Tan, Cher Ming (Ntu, S'pore) - Books - World Scientific Publishing Co Pte Ltd - 9789814273329 - August 25, 2010
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Electromigration In Ulsi Interconnections - International Series On Advances In Solid State Electronics And Technology

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Presents a description of the electro migration in integrated circuits. This book examines the various interconnected systems and their evolution employed in integrated circuit technology. It is suitable for readers on electro migration in ULSI interconnections.


312 pages, illustrations

Media Books     Hardcover Book   (Book with hard spine and cover)
Released August 25, 2010
ISBN13 9789814273329
Publishers World Scientific Publishing Co Pte Ltd
Pages 312
Dimensions 155 × 229 × 23 mm   ·   589 g

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