Design and Modeling for 3D Ics and Interposers - Wspc Series in Advanced Integration and Packaging - Madhavan Swaminathan - Books - World Scientific Publishing Co Pte Ltd - 9789814508599 - 2014
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Madhavan Swaminathan
Design and Modeling for 3D Ics and Interposers - Wspc Series in Advanced Integration and Packaging

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380 pages

Media Books     Hardcover Book   (Book with hard spine and cover)
Released 2014
Original release date 2013
ISBN13 9789814508599
Publishers World Scientific Publishing Co Pte Ltd
Pages 380
Dimensions 236 × 156 × 26 mm   ·   657 g

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