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Hybrid Bonding, Advanced Substrates, Failure Mechanisms, and Thermal Management for Chiplets and Heterogeneous Integration John Lau
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Hybrid Bonding, Advanced Substrates, Failure Mechanisms, and Thermal Management for Chiplets and Heterogeneous Integration
John Lau
This book is an essential resource for researchers, engineers, and students in electrical engineering, mechanical engineering, materials science, and industrial engineering, equipping them with the knowledge to advance innovation in semiconductor packaging and integration.
| Media | Books Hardcover Book (Book with hard spine and cover) |
| Released | May 19, 2025 |
| ISBN13 | 9789819641659 |
| Publishers | Springer Nature Switzerland AG |
| Pages | 645 |
| Dimensions | 150 × 220 × 20 mm · 1.28 kg |
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