Micro- and Opto-Electronic Materials and Structures: Physics, Mechanics, Design, Reliability, Packaging: Volume I Materials Physics - Materials Mechanics. Volume II Physical Design - Reliability and Packaging - Y C Lee - Books - Springer-Verlag New York Inc. - 9780387279749 - October 1, 2006
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Y C Lee
Micro- and Opto-Electronic Materials and Structures: Physics, Mechanics, Design, Reliability, Packaging: Volume I Materials Physics - Materials Mechanics. Volume II Physical Design - Reliability and Packaging 2007 edition

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This handbook provides the most comprehensive, up-to-date and easy-to-apply information on the physics, mechanics, reliability and packaging of micro- and opto-electronic materials.

1460 pages, biography

Media Books     Hardcover Book   (Book with hard spine and cover)
Released October 1, 2006
Original release date 2007
ISBN13 9780387279749
Publishers Springer-Verlag New York Inc.
Pages 1460
Dimensions 178 × 254 × 73 mm   ·   3.43 kg
Language English  
Editor Lee, Y.C.
Editor Suhir, Ephraim
Editor Wong, C.P.

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