Solder Paste in Electronics Packaging: Technology and Applications in Surface Mount, Hybrid Circuits, and Component Assembly - Jennie Hwang - Books - Van Nostrand Reinhold Inc.,U.S. - 9780442013530 - September 24, 1992
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Jennie Hwang
Solder Paste in Electronics Packaging: Technology and Applications in Surface Mount, Hybrid Circuits, and Component Assembly New edition

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One of the strongest trends in the design and manufacture of modern electronics packages and assemblies is the utilization of surface mount technology as a replacement for through-hole tech nology.

456 pages, 77 black & white illustrations, biography

Media Books     Paperback Book   (Book with soft cover and glued back)
Released September 24, 1992
ISBN13 9780442013530
Publishers Van Nostrand Reinhold Inc.,U.S.
Pages 456
Dimensions 152 × 229 × 24 mm   ·   639 g
Language English  

See all of Jennie Hwang ( e.g. Hardcover Book and Paperback Book )