The Simulation of Thermomechanically Induced Stress in Plastic Encapsulated IC Packages - Gerard Kelly - Books - Springer - 9780792384854 - April 30, 1999
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Gerard Kelly
The Simulation of Thermomechanically Induced Stress in Plastic Encapsulated IC Packages 1999 edition

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One of the greatest challenges facing package manufacturers is to develop reliable fine pitch thin packages with high leadcounts, capable of dissipating heat, and deliver them in volume to the market in a very short space of time.

134 pages, biography

Media Books     Hardcover Book   (Book with hard spine and cover)
Released April 30, 1999
ISBN13 9780792384854
Publishers Springer
Pages 134
Dimensions 170 × 244 × 11 mm   ·   408 g
Language English  

See all of Gerard Kelly ( e.g. Paperback Book and Hardcover Book )