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The Simulation of Thermomechanically Induced Stress in Plastic Encapsulated Ic Packages Gerard Kelly Softcover Reprint of the Original 1st Ed. 1999 edition
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The Simulation of Thermomechanically Induced Stress in Plastic Encapsulated Ic Packages
Gerard Kelly
153 pages, black & white illustrations, bibliography
| Media | Books Paperback Book (Book with soft cover and glued back) |
| Released | October 8, 2012 |
| ISBN13 | 9781461372769 |
| Publishers | Springer-Verlag New York Inc. |
| Pages | 134 |
| Dimensions | 155 × 235 × 9 mm · 235 g |
| Language | English |
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