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Thermal Design of Electronic Equipment - Electronics Handbook Series Remsburg, Ralph (Opvista, Irvine, California, USA) 1st edition
Thermal Design of Electronic Equipment - Electronics Handbook Series
Remsburg, Ralph (Opvista, Irvine, California, USA)
Presents the formulas used by electronic packaging and thermal engineers. This book presents heat transfer equations dealing with polyalphaolephin, silicone oils, perfluorocarbons, and silicate ester-based liquids. It presents empirical formulas and practical techniques that lets you solve thermal engineering problem in electronic packaging.
400 pages, 63 black & white tables
| Media | Books Hardcover Book (Book with hard spine and cover) |
| Released | September 27, 2000 |
| ISBN13 | 9780849300820 |
| Publishers | Taylor & Francis Inc |
| Pages | 396 |
| Dimensions | 241 × 168 × 28 mm · 732 g |
| Language | English |
| Series Editor | Dorf, Richard C. (University of California, Davis, USA) |
| Series Editor | Whitaker, Jerry C. (Technical Press, Morgan Hill, California, USA) |