Electronic Packaging Materials and Their Properties - Electronic Packaging - Pecht, Michael (University of Maryland, College Park, USA) - Books - Taylor & Francis Inc - 9780849396250 - December 18, 1998
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Pecht, Michael (University of Maryland, College Park, USA)
Electronic Packaging Materials and Their Properties - Electronic Packaging 1st edition

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Examines the array of packaging architecture, outlining the classification of materials and their use for various tasks requiring performance over time. This book discusses applications such as interconnections, printed circuit boards, substrates, encapsulants, dielectrics, die attach materials, electrical contacts, thermal materials, and solders.

128 pages, 61 Tables, black and white

Media Books     Hardcover Book   (Book with hard spine and cover)
Released December 18, 1998
ISBN13 9780849396250
Publishers Taylor & Francis Inc
Pages 120
Dimensions 150 × 220 × 20 mm   ·   354 g
Language English  

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