Arbitrary Modeling of Tsvs for 3D Integrated Circuits - Analog Circuits and Signal Processing - Khaled Salah - Books - Springer International Publishing AG - 9783319076102 - September 5, 2014
In case cover and title do not match, the title is correct

Khaled Salah
Arbitrary Modeling of Tsvs for 3D Integrated Circuits - Analog Circuits and Signal Processing 2015 edition

Price
$ 106.49
excl. VAT

Ordered from remote warehouse

Expected to be ready for shipping Jun 30 - Jul 6

Our customers say:

14-day return policy in accordance with European consumer protection law
Top ranking on Trustpilot
Add to your iMusic wish list

Also available as:

This book presents a wide-band and technology independent, SPICE-compatible RLC model for through-silicon vias (TSVs) in 3D integrated circuits. This model accounts for a variety of effects, including skin effect, depletion capacitance and nearby contact effects. Readers will benefit from in-depth coverage of concepts and technology such as 3D integration, Macro modeling, dimensional analysis and compact modeling, as well as closed form equations for the through silicon via parasitics. Concepts covered are demonstrated by using TSVs in applications such as a spiral inductor and inductive-based communication system and bandpass filtering.

271 pages, 60 black & white illustrations, 99 colour illustrations, 58 black & white tables, 5 colou

Media Books     Hardcover Book   (Book with hard spine and cover)
Released September 5, 2014
ISBN13 9783319076102
Publishers Springer International Publishing AG
Pages 271
Dimensions 155 × 235 × 13 mm   ·   449 g
Language English  

Mere med samme udgiver

See all of Khaled Salah ( e.g. Hardcover Book and Paperback Book )