Arbitrary Modeling of TSVs for 3D Integrated Circuits - Analog Circuits and Signal Processing - Khaled Salah - Books - Springer International Publishing AG - 9783319374970 - August 23, 2016
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Khaled Salah
Arbitrary Modeling of TSVs for 3D Integrated Circuits - Analog Circuits and Signal Processing Softcover reprint of the original 1st ed. 2015 edition

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This book presents a wide-band and technology independent, SPICE-compatible RLC model for through-silicon vias (TSVs) in 3D integrated circuits.

188 pages, 60 black & white illustrations, 99 colour illustrations, 58 black & white tables, 5 colou

Media Books     Paperback Book   (Book with soft cover and glued back)
Released August 23, 2016
ISBN13 9783319374970
Publishers Springer International Publishing AG
Pages 179
Dimensions 155 × 235 × 10 mm   ·   276 g
Language German  

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