Tell your friends about this item:
Fan-Out Wafer-Level Packaging John H. Lau Softcover Reprint of the Original 1st 2018 edition
Price
$ 114.99
excl. VAT
Ordered from remote warehouse
Expected to be ready for shipping Jun 2 - 8
Our customers say:
Add to your iMusic wish list
Also available as:
Fan-Out Wafer-Level Packaging
John H. Lau
This comprehensive guide to fan-out wafer-level packaging (FOWLP) technology compares FOWLP with flip chip and fan-in wafer-level packaging.
303 pages, 150 Tables, color; 226 Illustrations, color; 52 Illustrations, black and white; XX, 303 p
| Media | Books Paperback Book (Book with soft cover and glued back) |
| Released | December 16, 2018 |
| ISBN13 | 9789811342660 |
| Publishers | Springer Verlag, Singapore |
| Pages | 303 |
| Dimensions | 150 × 220 × 10 mm · 493 g |
![Cover for John H. Lau · Chiplet Design and Heterogeneous Integration Packaging (Paperback Book) [2023 edition] (2024)](https://imusic.b-cdn.net/images/item/original/192/9789811999192.jpg?john-h-lau-2024-chiplet-design-and-heterogeneous-integration-packaging-paperback-book&class=scaled&v=1722057566)
![Cover for John H. Lau · Semiconductor Advanced Packaging (Paperback Book) [2021 edition] (2022)](https://imusic.b-cdn.net/images/item/original/784/9789811613784.jpg?john-h-lau-2022-semiconductor-advanced-packaging-paperback-book&class=scaled&v=1653589884)
![Cover for John H. Lau · Assembly and Reliability of Lead-Free Solder Joints (Paperback Book) [2020 edition] (2021)](https://imusic.b-cdn.net/images/item/original/220/9789811539220.jpg?john-h-lau-2021-assembly-and-reliability-of-lead-free-solder-joints-paperback-book&class=scaled&v=1622167029)
![Cover for John H. Lau · Solder Joint Reliability: Theory and Applications (Paperback Book) [Softcover reprint of the original 1st ed. 1991 edition] (2014)](https://imusic.b-cdn.net/images/item/original/437/9781461367437.jpg?john-h-lau-2014-solder-joint-reliability-theory-and-applications-paperback-book&class=scaled&v=1516985150)