Assembly and Reliability of Lead-Free Solder Joints - John H. Lau - Books - Springer Verlag, Singapore - 9789811539220 - May 30, 2021
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Assembly and Reliability of Lead-Free Solder Joints 2020 edition

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527 pages, 250 Tables, color; 347 Illustrations, color; 251 Illustrations, black and white; XXI, 527

Media Books     Paperback Book   (Book with soft cover and glued back)
Released May 30, 2021
ISBN13 9789811539220
Publishers Springer Verlag, Singapore
Pages 527
Dimensions 150 × 220 × 10 mm   ·   942 g

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