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Assembly and Reliability of Lead-Free Solder Joints John H. Lau 2020 edition
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Assembly and Reliability of Lead-Free Solder Joints
John H. Lau
527 pages, 250 Tables, color; 347 Illustrations, color; 251 Illustrations, black and white; XXI, 527
| Media | Books Hardcover Book (Book with hard spine and cover) |
| Released | May 30, 2020 |
| ISBN13 | 9789811539190 |
| Publishers | Springer Verlag, Singapore |
| Pages | 527 |
| Dimensions | 150 × 220 × 20 mm · 1.09 kg |
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