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Microelectronics Packaging Handbook: Subsystem Packaging Part III R.R. Tummala 2nd ed. 1997 edition
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Microelectronics Packaging Handbook: Subsystem Packaging Part III
R.R. Tummala
Part II: Semiconductor Packaging discusses the interconnection of the IC chip to the first level of packaging and all first level packages.
657 pages, biography
| Media | Books Hardcover Book (Book with hard spine and cover) |
| Released | January 31, 1997 |
| ISBN13 | 9780412084515 |
| Publishers | Chapman and Hall |
| Pages | 628 |
| Dimensions | 155 × 235 × 36 mm · 993 g |
| Language | English French |
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