Manufacturing Challenges in Electronic Packaging - Lee - Books - Chapman and Hall - 9780412620300 - December 31, 1997
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Lee
Manufacturing Challenges in Electronic Packaging 1998 edition

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About five to six years ago, the words 'packaging and manufacturing' started to be used together to emphasize that we have to make not only a few but thousands or even millions of packages which meet functional requirements.

261 pages, biography

Media Books     Hardcover Book   (Book with hard spine and cover)
Released December 31, 1997
ISBN13 9780412620300
Publishers Chapman and Hall
Pages 261
Dimensions 155 × 235 × 17 mm   ·   562 g
Language English  
Editor Chen, W.T.
Editor Lee, Y.C.

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